ds830a rev date: 8/12 CERAMIC/hermetic CERAMIC/hermetic package assembly CERAMIC/hermetic packages are commonly used for applications requiring high performance and high reliability. they can generally withstand higher temperatures than traditional plastic packages, and the relatively low cte of CERAMIC materials and the cavity construction also make CERAMIC/hermetic packages ideal for extremely stress- sensitive devices such as mems sensors. amkor supports a wide range of assembly options for CERAMIC/hermetic packages, including commercial, automotive, and military/aerospace process flows. the assembly line is highly customizable, allowing assembly of a large variety of commonly used CERAMIC/hermetic packages. services and support amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at low cost. ? full package characterization ? thermal, mechanical stress and electrical performance modeling ? turnkey assembly, test and drop ship ? world class reliability testing and failure analysis common package families ? CERAMIC ball grid array (cbga) ? CERAMIC pin grid array (cpga) ? CERAMIC land grid array (clga) ? CERAMIC quad flat pack (cqfp) ? CERAMIC soic (csoic) ? cerdip ? cerpak ? jcerquad ? leaded chip carrier (ldcc) ? leadless chip carrier (lcc) ? low cost pin grid array (lcpga) ? plastic pin grid array (ppga) ? side braze ? flatpack ? flatpack with CERAMIC bar (fpcb) process options ? wafer backgrinding ? die attach cure/organic burn out up to 425c ? eutectic bonding ? glass or solder seal up to 435c ? temperature cycling ? centrifuge ? tin plating ? pin d testing ? laser or ink marking ? fine leak testing ? gross leak testing material options ? aluminum or gold wire interconnect ? ag glass or epoxy die attach note that CERAMIC package base and lid can be purchased from several well known suppliers and should be consigned to amkor for production assembly. contact your amkor account management team for more details. leadframe visit amkor technology online for locations and to view the most current product information. with respect to the information in this document, amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. this document does not in any way extend or modify amkors warranty on any product beyond that set forth in its standard terms and conditions of sale. amkor reserves the right to make changes in its product and specifications at any time and without notice. ? 2013, amkor technology incorporated. all rights reserved. CERAMIC/hermetic data sheet
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